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DMV1500L
DAMPER + MODULATION DIODE FOR VIDEO
Table 1: Main Product Characteristics IF(AV) VRRM trr (max) VF (max) DAMPER 4A 1500 V 170 ns 1.5V MODUL. 3A 600 V 50 ns 1.4 V
DAMPER MODULATION
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FEATURES AND BENEFITS


Full kit in one package High breakdown voltage capability Very fast recovery diode Specified turn on switching characteristics Low static and peak forward voltage drop for low dissipation Insulated version: Insulated voltage = 2000 VRMS Capacitance = 7 pF Planar technology allowing high quality and best electrical characteristics Outstanding performance of well proven DTV as damper and new faster Turbo 2 600V technology as modulation
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TO-220FPAB DMV1500LFD
2 1 3
DESCRIPTION High voltage semiconductor especially designed for horizontal deflection stage in standard and high resolution video display with E/W correction. The insulated TO-220FPAB package includes both the DAMPER diode and the MODULATION diode, thanks to a dedicated design. Assembled on automated line, it offers very low dispersion values on insulating and thermal performances. Table 2: Order Codes Part Number DMV1500LFD DMV1500LFD5 Marking DMV1500L DMV1500L
TO-220FPAB F5 Bending DMV1500LFD5 (optional)
September 2004
REV. 1
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Table 3: Absolute Maximum Ratings Symbol VRRM IFSM Tstg Tj Parameter Repetitive peak reverse voltage Surge non repetitive forward current Storage temperature range Maximum operating junction temperature tp = 10ms sinusoidal Value Damper Modul. 1500 50 150 600 35 Unit V A C C
-40 to +150
Table 4: Thermal Resistance Symbol Rth(j-c) Parameter Junction to case thermal resistance Value 4.0 Unit C/W
Table 5: Static Electrical Characteristics Value Symbol Parameter Test conditions Damper Modul. Damper Modul. VR = 1500 V VR = 600 V IF = 4 A IF = 3 A 1.2 Tj = 25C Typ. IR * VF **
Pulse test:
Tj = 125C Typ. 100 3 1.1 1.1 Max. 1000 50 1.5 1.4
Unit
Max. 100 20 1.7 1.8
Reverse leakage current
A
Forward voltage drop
* tp = 5 ms, < 2%
V
** tp = 380 s, < 2% To evaluate the maximum conduction losses of the DAMPER and MODULATION diodes use the following equations : DAMPER: P = 1.2 x IF(AV) + 0.075 x IF (RMS) MODULATION: P = 1.12 x IF(AV) + 0.092 x IF (RMS)
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Table 6: Recovery Characteristics Value Symbol Parameter Test conditions IF = 100mA IR =100mA IRR = 10mA IF = 1A dIF/dt = -50 A/s VR =30V Damper Typ. Tj = 25C 850 Max. Modul. Typ. 110 Max. 350 ns Tj = 25C 130 170 35 50 Unit
trr
Reverse recovery time
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Table 7: Turn-On Switching Characteristics Symbol Parameter Test conditions IF = 4 A dIF/dt = 80 A/s VFR = 3 V IF = 6.5 A dIF/dt = 50 A/s VFR = 3 V IF = 3 A dIF/dt = 80 A/s VFR = 2 V IF = 4 A dIF/dt = 80 A/s IF = 6.5 A dIF/dt = 50 A/s IF = 3 A dIF/dt = 80 A/s Value Typ. Tj = 100C Max. 450 Unit
Damper tfr Forward recovery time
Tj = 25C
450
ns
Modul.
Tj = 100C
240
Tj = 100C Tj = 25C Tj = 100C
28 13
36 17 8 V
Damper VFP Peak forward voltage Modul.
Figure 1: Power dissipation versus peak forward current (triangular waveform, =0.45)
PF(AV)(W)
2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Figure 2: Average forward current versus ambient temperature
IF(AV)(A)
7
Rth(j-a)=Rth(j-c)
6
DAMPER diode
5 4
Rth(j-a)=Rth(j-c)
3 2
MODULATION diode
T
1
IP(A)
0 0
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
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Figure 3: Forward voltage drop versus forward current (damper diode)
IFM(A)
30
Tj=125C (maximum values)
Figure 4: Forward voltage drop versus forward current (modulation diode)
IFM(A)
30
Tj=125C (maximum values)
25
25
20
Tj=125C (typical values)
20
15
15
Tj=25C (maximum values)
Tj=125C (typical values) Tj=25C (maximum values)
10
10
5
5
VFM(V)
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
VFM(V)
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Figure 5: Relative variation of thermal impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0 0.9
Figure 6: Non repetitive peak forward current versus overload duration (damper diode)
IM(A)
35 30
0.8 0.7 0.6 0.5 0.4 0.3 0.2 5 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 15 10
TC=125C
IM
25
MODULATION diode DAMPER diode TC=25C
20
TC=75C
tp(s)
t
Single pulse
=0.5
t(s)
1.E-02 1.E-01 1.E+00
0 1.E-03
Figure 7: Non repetitive peak forward current versus overload duration (modulation diode)
IM(A)
30
Figure 8: Reverse recovery charges versus dIF/dt (damper diode)
Qrr(nC)
2.4 2.2
IF=IP Tj=125C 90% confidence
25
2.0 1.8
20
TC=25C
1.6 1.4 1.2
TC=75C
15
1.0 0.8
10
TC=125C
0.6 0.4
5
IM t
=0.5
t(s)
1.E-02 1.E-01 1.E+00
0.2 0.0 0.1
dIF/dt(A/s)
1.0 10.0
0 1.E-03
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Figure 9: Reverse recovery charges versus dIF /dt (modulation diode)
Qrr(nC)
200
IF=IP Tj=125C 90% confidence
Figure 10: Peak reverse recovery current versus dIF/dt (damper diode)
IRM(A)
3.0
IF=IP Tj=125C 90% confidence
2.5
150 2.0
100
1.5
1.0 50 0.5
dIF/dt(A/s)
0 0.1 1.0 10.0 100.0
dIF/dt(A/s)
0.0 0.1 1.0 10.0
Figure 11: Peak reverse recovery current versus dIF/dt (modulation diode)
IRM(A)
6.0
IF=IP Tj=125C 90% confidence
Figure 12: Transient peak forward voltage versus dIF/dt (damper diode)
VFP(V)
50 45 40 35 30
IF=IP Tj=125C 90% confidence
5.0
4.0
3.0
25 20
2.0
15 10
1.0
dIF/dt(A/s)
0.0 1 10 100 1000
5 0 0 20 40
dIF/dt(A/s)
60 80 100 120 140
Figure 13: Transient peak forward voltage versus dIF/dt (modulation diode)
VFP(V)
12 11 10 9 8 7 6 5 4 3 2 1 0 0 20 40 60
IF=IP Tj=125C 90% confidence
Figure 14: Forward recovery time versus dIF/dt (damper diode)
tfr(ns)
700 650 600 550 500 450 400 350 300
IF=IP Tj=125C VFR=3V 90% confidence
dIF/dt(A/s)
80 100 120 140 160 180 200
250 200 0 20 40
dIF/dt(A/s)
60 80 100 120 140
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Figure 15: Forward recovery time versus dIF/dt (modulation diode)
tfr(ns)
200 175 150
IF=IP Tj=125C VFR=2V 90% confidence
Figure 16: Relative variation of dynamic parameters versus junction temperature
IRM, VFP, QRR [Tj]/ IRM, VFP, QRR [Tj=125C]
1.2
1.0
0.8 125
VFP
100 75
0.6
IRM
0.4 50 0.2 25
QRR
dIF/dt(A/s)
0 0 20 40 60 80 100 120 140 160 180 200 0.0 25 50
Tj(C)
75 100 125
Figure 17: Junction capacitance versus reverse voltage applied (typical values)
C(pF)
100
F=1MHz VOSC=30mVRMS Tj=25C MODULATION diode
10
DAMPER diode
VR(V)
1 1 10 100 1000
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Figure 18: TO-220FPAB Package Mechanical Data REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.9 0.173 0.192 2.5 2.9 0.098 0.114 2.45 2.75 0.096 0.108 0.4 0.7 0.016 0.027 0.6 1 0.024 0.039 1.15 1.7 0.045 0.067 1.15 1.7 0.045 0.067 4.95 5.2 0.195 0.205 2.4 2.7 0.094 0.106 10 10.7 0.393 0.421 16 Typ. 0.630 Typ. 28.6 30.6 1.126 1.205 9.8 10.7 0.385 0.421 15.8 16.4 0.622 0.646 9 9.9 0.354 0.390 2.9 3.5 0.114 0.138
A B D E F F1 F2 G G1 H L2 L3 L4 L6 L7 Dia.
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Figure 19: TO-220FPAB F5 Bending (option) Package Mechanical Data REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.9 0.173 0.192 2.5 2.9 0.098 0.114 2.45 2.75 0.096 0.108 0.4 0.7 0.016 0.027 0.6 1 0.024 0.039 1.15 1.7 0.045 0.067 1.15 1.7 0.045 0.067 4.95 5.2 0.195 0.205 2.4 2.7 0.094 0.106 10 10.7 0.393 0.421 16 Typ. 0.630 Typ. 24.16 26.9 0.951 1.059 1.65 2.41 0.065 0.095 15.8 16.4 0.622 0.646 9 9.9 0.354 0.390 2.92 3.3 0.115 0.130 1.4 Typ. 0.055 Typ. 2.9 3.5 0.114 0.138
A B D E F F1 F2 G G1 H L2 L3 L4 L6 L7 M1 R Dia.
Table 8: Ordering Information Part Number DMV1500LFD DMV1500LFD5 Marking DMV1500L DMV1500L Package TO-220FPAB TO-220FPAB F5 Weight 2.4 g 2.4 g Base qty 50 45 Delivery mode Tube Tube
Table 9: Revision History Date 07-Sep-2004 Revision 1 Description of Changes First issue
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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